**Jamie Dimon warns investors underestimate economic risks, says he wouldn't buy stocks or long-dated Treasurys at current prices** – The JPMorgan Chase CEO cautioned that markets are not fully pricing in geopolitical threats and fiscal dangers, including wars in Ukraine and the Middle East, U.S.-China tensions, and rising government deficits.
In an interview released Monday, Dimon said it is difficult to know what risks are already reflected in asset prices, but that "what's not baked in is what actually happens." His warning contrasts with investor optimism that has driven the S&P 500 nearly 10% higher this year, supported by resilient consumer spending, moderating inflation, and the artificial intelligence trade. JPMorgan and its peers recently posted blockbuster quarterly results from surging trading and investment banking revenue.
Dimon acknowledged the global economy is more resilient due to lower energy dependence but warned that a sudden tipping point remains possible. He predicted persistent U.S. budget deficits will eventually force interest rates higher as "bond vigilantes" demand greater compensation for government debt. Even if inflation falls to the Fed's 2% target, Dimon said the 10-year Treasury yield should be 4% to 4.5%, adding he sees little upside for bond prices.
On equities, Dimon said he would not buy the broader market at current valuations, though he might consider individual stocks. Regarding AI, he compared today's spending boom to the early internet era, noting that while the investment may pay off overall, the timeline and winners are uncertain—citing how Yahoo and Netscape faded while Google and Facebook emerged later.
Google is reportedly developing a new chip that embeds information from its Gemini AI models directly onto the silicon to boost efficiency. If the anticipated performance gains materialize, this new design would mark a deeper integration of the tech giant's...
Haesung DS has reportedly added China's CXMT as a customer for DDR5 package substrates as the South Korean supplier expands its DDR5 business and considers panel-based production for higher-layer-count products expected with the DDR6 generation.
Innolume GmbH has purchased Veeco Instruments' GEN2000 molecular beam epitaxy (MBE) system to expand quantum dot laser production for next-generation optical transceivers and AI-driven data center interconnects, addressing surging demand for co-packaged optics in hyperscale AI infrastructure. The investment, announced 21 July 2026, supports Innolume's ramp in manufacturing capacity for quantum dot (QD) diode lasers, which offer superior temperature stability, low power consumption, and high reliability—key requirements for future silicon photonics and co-packaged optics (CPO) architectures.
The GEN2000 MBE system, recognized for high throughput and low cost-of-ownership, will enable Innolume to meet growing customer demand as hyperscale AI and cloud computing drive optical connectivity needs. Market researcher LightCounting notes that CPO deployments are accelerating, with sales of optical transceivers using QD lasers projected to reach nearly $80 billion by 2031. QD lasers provide narrow spectral linewidth and low threshold current, making them ideal emitters for CPO.
Innolume CEO Sven Rüger stated that the GEN2000 provides the production capacity, material quality, and manufacturing efficiency required for their technology roadmap. Veeco’s VP & general manager for MBE, Matthew Marek, emphasized that the investment underscores the rising importance of MBE-grown QD lasers. Additionally, Innolume is installing Veeco’s Spector ion beam deposition system to expand in-house coating capabilities for ultra-low-loss anti-reflective and highly reflective laser facet coatings, strengthening end-to-end photonic device manufacturing. This dual adoption of Veeco’s MBE and ion beam platforms highlights complementary process technologies for high-volume production.
ABB acquires silicon carbide power conversion firm Advantics to expand DC portfolio for data centers, microgrids, and EV infrastructure.
Electrification and automation technology provider ABB (Zurich, Switzerland) is acquiring Advantics (Saint-Genis-Pouilly, France), a specialist in silicon carbide (SiC)-based power conversion solutions that integrate hardware, firmware, and software for demanding applications including data centers, industrial microgrids, power generation, and EV infrastructure. The acquisition, expected to close by Q4 2026, expands ABB’s direct current (DC) portfolio to meet accelerating demand for efficient DC solutions. The IEA forecasts electricity’s share of final energy consumption will rise from 20% today to about 36% by 2035. ABB states its DC solutions minimize repeated AC/DC conversion and maximize efficiency using advanced semiconductor technology. Advantics’ power converter modules deliver up to 99% efficiency. “ABB offers industry-leading DC solutions, and Advantics’ power converter technology and world-class engineering talent are a perfect match,” said Massimiliano Cifalitti, president of ABB’s Smart Power division. “Together, we will accelerate next-generation DC solutions for data centers, industrial microgrids, and EV infrastructure.” Advantics founder & CEO Michal Elias added, “As the world electrifies, demand for efficient, intelligent power conversion is accelerating faster than ever. ABB shares our vision.” ABB has over 140 years of history and around 110,000 employees. Its shares are listed on SIX Swiss Exchange (ABBN) and Nasdaq Stockholm (ABB).
SanDisk Optimus GX Pro 8TB 8100 Gen5 SSD review: PCIe 5.0 NVMe drive delivers 14.9GB/s reads, 13.2GB/s writes, and 4,800TBW endurance, but pricing has surged to $2,149 USD / $5,799 CAD amid rising NAND costs.
The SanDisk Optimus GX Pro 8100 (rebranded from WD_Black SN8100) is a PCIe 5.0 x4 NVMe 2.0 SSD available in 1TB, 2TB, 4TB, and 8TB capacities. The 8TB model uses a double-sided PCB with four SanDisk 218-layer BiCS 8 TLC CBA 3D NAND chips and a SanDisk-branded Silicon Motion SM2508 8-channel controller, plus DDR4 DRAM. Performance specs for the 8TB version: sequential reads up to 14.9GB/s, writes up to 13.2GB/s, random read/write IOPS of 2,200K/2,400K. The drive supports TCG Opal 2.02 encryption and is rated for 4,800TBW with a five-year warranty. Lower capacities are single-sided with average active power of 6.5W read/7W write, making them suitable for laptops.
Pricing has escalated dramatically: the 2TB model now costs $549.99 on Amazon (down from $279.99), while the 8TB version is listed at $2,149 in the US and an eye-watering $5,799.99 on Amazon Canada. The reviewer notes the drive’s endurance and speed parallel a cross-Canada motorcycle ride raising awareness for PTSD and mental wellness among military and first responder veterans—a cause supported by the Rolling Barrage event.
NVIDIA Vera CPU takes center stage this week as the company releases its deepest technical disclosure yet on the upcoming server processor, including a full architectural whitepaper and fresh SPEC CPU 2026 benchmarks, ahead of Intel’s earnings and AMD’s Advancing AI event. The new details reveal that Vera features 88 Olympus CPU cores with spatial multithreading (176 threads), a 10-wide decoder fed by a 16-instruction fetch unit, 64KB L1 instruction cache and 96KB L1 data cache per core, 2MB L2 per core, and a 164MB unified L3 cache. Memory bandwidth reaches up to 1.2TB/s via LPDDR5X, with NVLink-C2C interconnects at 1.8TB/s and PCIe Gen6/CXL 3.1 support. The Olympus core employs memory renaming, value prediction, and move elimination to boost instruction-level parallelism, backed by 18 execution pipes (8 integer, 6 vector/SIMD). TDP ranges from 250W to 450W. While NVIDIA positions Vera as a broader server CPU—not just a GPU companion like Grace—the benchmarks show competitive but not universally dominant performance against Intel Xeon and AMD EPYC. The disclosures underscore NVIDIA’s push to grow in the lucrative server CPU market, aiming to pair Vera tightly with Rubin GPUs and dissuade customers from using rival processors.
TSMC expects "strong, multi-year" demand for AI chips as it ramps up its Arizona investment, signaling sustained growth in the semiconductor foundry sector. The Taiwanese chipmaker projects that surging adoption of artificial intelligence in data centers and edge devices will drive long-term orders, bolstering its expansion plans for the U.S. fabrication facility. The Arizona plant, part of TSMC's global capacity buildup, is positioned to serve major AI chip customers amid rising geopolitical pressures to diversify supply chains. This outlook aligns with broader industry trends, where AI chip demand is fueling investments in advanced nodes and packaging. The company's confidence in multi-year demand underscores the critical role of foundry capacity in powering AI workloads, reinforcing expectations for robust capital expenditure and revenue growth in the semiconductor ecosystem.
Keysight Technologies returns to the 2026 Design Automation Conference (DAC) as a Silver Sponsor and “I LOVE DAC” sponsor, showcasing its Design Engineering Software portfolio at Booth #927 from July 26-29 in Long Beach, Calif., targeting chip, package, RF/microwave, and quantum design engineers seeking EDA, AI-driven workflows, and advanced packaging solutions. The Keysight team will be on-site Monday through Wednesday (July 27-29) for live demos and one-on-one meetings, which attendees can book in advance via Keysight’s DAC event page. The company’s program addresses thorny chip and system design challenges, including accelerating agentic design workflows with surrogate modeling, managing and curating data for EDA AI workflows, and die-to-die signal integrity for advanced packaging. Advanced packaging engineers can explore chiplet, 3DIC, and 3D-HI interconnect challenges, including a poster on mixed-domain modeling for hatched ground planes validated on silicon bridge and mobile PCB test vehicles. Quantum computing gets its own spotlight in the “From Bit to Qubit: EDA Meets Quantum” panel, examining how quantum EDA platforms and digital twins intersect with chip design workflows. At Booth #927, Keysight will demo engineering data management tools, including SOS Enterprise for governed, AI-ready engineering data at scale, and RF Circuit Simulation Professional featuring an executable RF design workflow tool. Sessions and demos target chip, package, and RF/microwave design engineers, quantum hardware teams, and EDA leadership evaluating AI and governed data integration. Registration for DAC 2026 is free through the “I LOVE DAC” program.
NetApp, an intelligent data infrastructure company, has acquired DataPelago, a California-based AI data infrastructure startup, to enable zero-copy activation of enterprise data for AI by bringing GPU-accelerated processing directly to the storage layer. The acquisition addresses a critical bottleneck in enterprise AI deployment: preparing, governing, and activating data fast enough to put AI into production. DataPelago’s core technology, Nucleus, is a universal data processing engine that uses heterogeneous accelerated computing across CPUs and GPUs to process data where it lives—at the storage layer, rather than moving it to external compute clusters. This approach reduces infrastructure costs by up to 80% and delivers performance up to 10 times faster than conventional methods, eliminating the need to copy data from operational systems to AI systems. NetApp CEO George Kurian said the deal extends NetApp’s ability to help customers understand and process data with the agility required to unleash competitive advantage. DataPelago founder and CEO Rajan Goyal noted that enterprises have invested billions in GPUs and AI models, but fragmented data leaves computing resources idle. NetApp CPO Syam Nair emphasized that the combination enables true zero-copy activation. Following the acquisition, DataPelago will operate as a wholly-owned subsidiary of NetApp. The deal follows NetApp’s recent partnerships with Cisco, Google Cloud, Red Hat, and SK Telecom, signaling continued growth in AI infrastructure.