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Tuple Technologies builds AI infrastructure for DAC 2026

5 h ago

Keysight Technologies returns to the 2026 Design Automation Conference (DAC) as a Silver Sponsor and “I LOVE DAC” sponsor, showcasing its Design Engineering Software portfolio at Booth #927 from July 26-29 in Long Beach, Calif., targeting chip, package, RF/microwave, and quantum design engineers seeking EDA, AI-driven workflows, and advanced packaging solutions. The Keysight team will be on-site Monday through Wednesday (July 27-29) for live demos and one-on-one meetings, which attendees can book in advance via Keysight’s DAC event page. The company’s program addresses thorny chip and system design challenges, including accelerating agentic design workflows with surrogate modeling, managing and curating data for EDA AI workflows, and die-to-die signal integrity for advanced packaging. Advanced packaging engineers can explore chiplet, 3DIC, and 3D-HI interconnect challenges, including a poster on mixed-domain modeling for hatched ground planes validated on silicon bridge and mobile PCB test vehicles. Quantum computing gets its own spotlight in the “From Bit to Qubit: EDA Meets Quantum” panel, examining how quantum EDA platforms and digital twins intersect with chip design workflows. At Booth #927, Keysight will demo engineering data management tools, including SOS Enterprise for governed, AI-ready engineering data at scale, and RF Circuit Simulation Professional featuring an executable RF design workflow tool. Sessions and demos target chip, package, and RF/microwave design engineers, quantum hardware teams, and EDA leadership evaluating AI and governed data integration. Registration for DAC 2026 is free through the “I LOVE DAC” program.