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Apple has announced a new multiyear commitment with Broadcom to design and produce custom silicon and advanced wireless connectivity components, with the deal expected to exceed $30 billion. The partnership, Apple’s largest under its American Manufacturing Program (AMP), will generate over 15 billion US-made chips and support hundreds of American jobs. Under the agreement, Broadcom will invest $1.5 billion to expand and modernize its Fort Collins, Colorado facilities — producing advanced radio frequency components including FBAR filters and cutting-edge wireless technologies for Apple products. The announcement advances Apple’s goal of building an end-to-end silicon supply chain in the US, building on its broader $600 billion US economy investment over four years. Apple CEO Tim Cook stated the partnership accelerates American manufacturing innovation. Broadcom CEO Hock Tan highlighted the expanded Fort Collins footprint as a hub for groundbreaking connectivity tech. Key entities: Apple, Broadcom, Fort Collins. Primary keywords: custom silicon, wireless connectivity, chip supply chain, US manufacturing, AMP. Search intent matches semiconductor and chip supply chain news.